열방산영양학사전 물체로부터 열에너지가 방출되는 것. 동물은 항상 체표면에서 열을 방산하고 있다. 체온을 유지하기 위해서 환경조건에 따라 피부의 혈류량이나 기모근의 수축 등에 의해 조절하고...
"Heat dissipation" redirects here. For passive heat dissipation in buildings, see passive cooling. 60×60×10 mm straight-finned heat sink with a thermal profile and swirling animated...
power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits....
In this paper, reduces the absolute temperature of the LED module, results of the experiments have been derived a method to improve the suitability heat dissipation structure and properties...
Rapid increase in heating by unit area due to lightweight, thin, small-size and high-integration trends in electronic goods; decrease in product life and reliability consequently ; Increase in the heat-dissipation issue due to the wide spread and high output of high-voltage LED chips; 57% in life expectancy and increase in efficiency by 14% when LED temperature drops by 10°C
Explore mechanical engineering tactics for managing heat dissipation in densely integrated mechatronic systems with our expert guide.
ITEM, Unit, KBE-TPDS10, KBE-TPDS30 ; Thermal conductivity, (W/mk), 1.0, 3.0 ; Color, -, White, gray, White, gray ; Density, (g/cm3), 1.6, 3.03
Explaining the mechanism of heat-dissipation, calculation of thermal resistance and other thermal characteristic parameters for semiconductor devices.
The new heat dissipation powder coating efficiently disperses heat inside electrical and electronic products and releases it to the outside, preventing devices from heating up and causing...
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