Rapid increase in heating by unit area due to lightweight, thin, small-size and high-integration trends in electronic goods; decrease in product life and reliability consequently ; Increase in the heat-dissipation issue due to the wide spread and high output of high-voltage LED chips; 57% in life expectancy and increase in efficiency by 14% when LED temperature drops by 10°C
ITEM, Unit, KBE-TPDS10, KBE-TPDS30 ; Thermal conductivity, (W/mk), 1.0, 3.0 ; Color, -, White, gray, White, gray ; Density, (g/cm3), 1.6, 3.03 ; Hardness, (shore ○○), 20~30, 40~50 ; Volume resistance, (Ω·cm), 1x10, 1x10 ; breakdown Voltage, kV, >15, >15 ; Thermal stability, -40~150℃, No change, No change ; Thickness, mm, 1, 2, 4, 1, 2, 4 ; Flame rating, UL94, V-0, V-0
"Heat dissipation" redirects here. For passive heat dissipation in buildings, see passive cooling. 60×60×10 mm straight-finned heat sink with a thermal profile and swirling animated...
ROHM discusses the concepts of thermal resistance and heat dissipation, as well as the calculation of junction temperature.
All the latest science news on heat dissipation from Phys.org. Find the latest news, advancements, and breakthroughs.
The graphene shell in the ZrC–SiC/TaC@C coating had a robust heat dissipation effect for lowering the surface temperature to approximately 200 °C under an oxyacetylene torch with a heat...
power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits....
Products with cooling, heat dissipation, heat exchange, and heating functions contribute to the thermal management of components for semiconductor manufacturing equipment, for example. NHK Spring u...
High Performance Dispenser DosP DP2001 ; Dispenser Dos P ; POWERFUL FEED PAILFEED 803
Explaining the mechanism of heat-dissipation, calculation of thermal resistance and other thermal characteristic parameters for semiconductor devices.